Siconnex is a global wet chemistry equipment manufacturer in semiconductors and related sectors. It specializes in manufacturing and supplying wet spraying equipment for the surface preparation of various end products, including MEMS, power semiconductors, and analog/mixed-signal semiconductors. The company’s solutions provide a sustainable and cost-effective alternative to the traditional wet bench process for wafer etching, cleaning, and stripping.

“Our solution significantly reduces the water and chemical consumption while ensuring the highest possible throughput,” says Fabio Wörndl, co-CEO and CMO at Siconnex.

Siconnex has architected an innovative BATCHSPRAY® technology that focuses on etching, cleaning, and stripping. It runs on a closed system, making wet chemical cleaning and etching processes more efficient. The process chamber is designed for one carrier with 25 wafers or two carriers with 50 wafers. More importantly, the automated system, called BATCHSPRAY® Autoload, features a throughput up to 600wph.

“Our solution can support wafers ranging from two inches to 12 inches. We have a patented technology for the automated loading of wafers into the chambers. With the BATCHSPRAY® technology, wafers get a big open area for etching, significantly improving the process outcomes,” says Wörndl. “Our focus on the BATCHSPARY technology enables us to continuously improve our solution to serve clients more effectively.”

Siconnex has also designed dry ozone gas processing technology, SicOzone, for wafer cleaning and resist stripping.

Dry ozone gas is environment-friendly, cost-efficient, and highly effective, aligning with the company’s commitment to sustainable practices.

For instance, a company in Germany used a traditional wet bench process for wafer cleaning, requiring them to rely on a huge amount of sulfuric acid, peroxide acid, and ammonia.

This, undoubtedly, was not an environment-friendly approach. Siconnex did an evaluation and replaced the old method with SicOzone technology, enabling the client to eliminate chemical usage and become environment-friendly.

This instance is a testament to how the company enables clients to achieve their sustainability objectives.

As a leader in this field, Siconnex always strives to evolve with the changing market dynamics. Its team keeps a close eye on how the market is evolving and understands customers’ needs and pain points to ensure they achieve the best outcomes.

Siconnex is currently working on a new process called post-etch residue clean (PERC™).

This was previously dependent on solvents that were hazardous to the environment. PERC™ is a greener way to conduct this task and get rid of solvents.

Its flagship BATCHSPRAY® technology and the PERC™ process are not overnight achievements. Years of market research and close attention to customer needs enabled by a strong business development team have enabled the company to grow continuously. Its outright focus on BATCHSPRAY® equipment and the recognition of upcoming trends and market gaps have also helped it develop new and innovative products that can address real-life customer problems.

Siconnex firmly believes in closely engaging with clients by thoroughly understanding their requirements. This approach has enabled it to adequately deal with every client and bring the best products to market.

“Our core competence is our highly sustainable BATCHSPRAY® technology, which requires only a small amount of chemistry. Furthermore, our systems have a small footprint and are therefore chosen by our customers as a space-saving alternative. We guarantee high quality, resource-saving technologies and know-how that is 100 percent in-house,” says Wörndl.